Saturday, October 11, 2014

INDIAPACK 2015 to be held at Bombay Exhibition Centre, #Mumbai from 08–11 Oct 2015

Dr. N.C. Saha, Director – IIP said, “It is heartening that the Institute is stepping in to 50th  year of service to the industry and, the INDIAPACK-2015 being organized during the golden jubilee year of the Institute. Coinciding with this Exhibition, Institute has also planned to host Two Days World Packaging Congress with theme of Packaging – Strategies for Global competitiveness. It is expected that the representative from 35 member countries of WPO will be participating in this mega event. It is also planned to concurrently organize Buyer Sellers Meet, Exhibitors Forum, INDIASTAR Award night”.

 Mr. Naveen Seth, Vice – President of TAFCON & Expo organizer of INDIAPACK 2015 said, “INDIAPACK the most prestigious international platform of this sector, as it serves the needs of packaging and allied sector across India and South Asia. It is a unique forum for technologies transfer, joint ventures and identifying potential investors to boost the packaging and allied industry in the country. Over 300 exhibitors are expected from over 30 countries showcasing state-of-art packaging machinery, materials, services and packaging solutions to the FMCG sector, brand owners and converters - over 15000 High Value business visitors expected”.

Mr. S. Vidhyashankar, IAS – Additional Chief Secretary to Government (Retired) & President – India Electronics & Semiconductor Association (IESA), Bangalore said,”India with its enviable natural wealth of fruits, vegetables, marine and dairy products, is fast emerging as a food factory to the world. We are also in the midst of a retail boom, and this coupled with the changing lifestyles, family structure and consumerism is bound to open up vast opportunities for the packaging industry in general and food packaging in particular, in the not too distant future. With the opening up of international global markets, we need to gear ourselves to meet international standards in packaging.